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August 27-29, 2027 | Four Star by Trans Hotel, Bali Indonesia

2027
International Conference
on Innovation and Quality
in Engineering and Technology
(2027 ICONIQ)

Innovation and Quality in Engineering and Technology:

Bridging Human Behavior and Social Dynamics for Trustworthy, High-Quality Technology

Venue
Four Star by Trans Hotel, Bali Indonesia
Event Format
Virtual

Supported by

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ICONIQ 2027

As engineering and technology reshape industries—enabling smart infrastructure, connected manufacturing, and intelligent services—innovation must be paired with quality, safety, and trust to deliver real impact.

2027 ICONIQ invites researchers, practitioners, and interdisciplinary scholars to explore how human behavior and social dynamics influence the design, adoption, and governance of technology—from requirements and verification, to human-centered evaluation, responsible engineering, and continuous improvement.

We welcome contributions that advance methods, systems, and applications; report evidence from real deployments; and propose frameworks that strengthen reliability, usability, fairness, and societal value. Together, let us build technologies that are not only novel, but also dependable and meaningful.

ICONIQ 2027 Tracks

T1
Signal Processing and Machine Intelligence
Topics
  • Image and speech processing
  • Pattern recognition
  • Machine learning
  • Deep learning
+ 5 more
Track 1 of 5
T2
Robotics and Internet of Things
Topics
  • Autonomous systems
  • Human–machine interaction
  • Cyber-physical systems
  • Sensors
+ 5 more
Track 2 of 5
T3
Communication, Networking, and Broadcasting
Topics
  • Communication Systems and Communication Standards
  • Acoustic and Underwater Communication
  • Security and Authentication
  • Adhoc Networks and Wireless Networks
+ 7 more
Track 3 of 5
T4
Information System
Topics
  • Big Data Analytics
  • Graph Analytics
  • Real-time Big Data Analysis
  • Data Models for Big and Smart Data
+ 10 more
Track 4 of 5
T5
Power, Energy, and Industry Applications
Topics
  • Smart grid technologies
  • Renewable energy systems
  • Power electronics
  • Energy storage
+ 3 more
Track 5 of 5

2027 International Conference (2027 ICONIQ)

Innovation and Quality in Engineering and Technology:

Bringing Human Behavior and Social Dynamics into the Technological Ecosystem

Four Star by Trans Hotel, Bali Indonesia
August 27-29, 2027

Important Dates

Deadline SubmissionMay 12, 2027
Notification of AcceptanceJuly 23, 2027
Early Bird RegistrationJuly 30, 2027
Normal RegistrationAugust 6, 2027
Full Paper (Camera Ready)August 13, 2027
Main ConferenceAugust 27-29, 2027
2027 ICONIQ
394
Day(s)
:
15
Hour(s)
:
33
Minute(s)
:
07
Second(s)

Target: Aug 27, 2027 (WIB)

Keynote Speakers

Prof. József András Fülöp

Prof. József András Fülöp

ELI-ALPS Research Institute, Hungary

Expert in Advanced Laser Systems and Research

Prof. Nur Iriawan, M.Ikom, Ph.D.

Prof. Nur Iriawan, M.Ikom, Ph.D.

Statistic Department, Institut Teknologi Sepuluh Nopember (ITS), Indonesia

Expert in Statistics and Data Analysis

Registration Fee

CategoryOnlineOffline
International Presenter35 USD70 USD
Indonesian PresenterIDR 500,000IDR 1,000,000
International Participant10 USD35 USD
Indonesian ParticipantIDR 100,000IDR 600,000

Registration Payment

The registration fee includes conference kits, certificate, lunch, and coffee breaks (for onsite registration only). Online registration only includes certificate.

Bank NameBANK BCA
Account NameASOSIASI PENELITI SAINS
Account Number8223653888

Address of Bank:
Jl. Kendangsari Industri 2, Kendangsari, Kec. Tenggilis Mejoyo, Kota Surabaya, Jawa Timur
Surabaya, Jawa Timur, Indonesia 60292

After registration via bank transfer, please scan
– The payment receipt
– Proof of APSKIN membership (optional)
– Student ID card (optional)

Confirmation of Payment & Registration

Replace this button link with your actual confirmation form URL.

ICONIQ 2026 Paper Template (Ms. Word Only)

Please refer to the paper template Manuscripts

Paper Submission

Please follow the Author Guidelines! Click Here

Organized by

APSKIN
IEEE
IEEE IMS